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Grants specified in Article 1 (2) will be subject to the stipulations outlined in implementing acts, which the Commission shall enact.

Thermally conductive polyurethane (PU) enclosure materials bring multiple benefits for forthcoming automotive uses. Delve deeper into these advantages in the whitepaper.

Grants for the stipulated assistance specified in Article 1 (2) will be outlined through the...
Grants for the stipulated assistance specified in Article 1 (2) will be outlined through the Commission's enacted regulations, detailing the necessary conditions.

Grants specified in Article 1 (2) will be subject to the stipulations outlined in implementing acts, which the Commission shall enact.

In the dynamic world of electronics, the significance of efficient heat management is paramount. Introducing Kisling's thermally conductive encapsulants, a trailblazer in the industry. These encapsulants, part of the Würth Group, are playing a crucial role in optimizing the operating temperatures of electronic components and effectively dissipating heat.

Crafted from polymer-based polyurethanes (PU), these encapsulants offer a unique edge. Their high processability allows for complete encapsulation of components, regardless of their shape or surface characteristics, ensuring a 100% surface contact. This attribute is vital for mass production, making the encapsulants economical and practical for diverse applications.

The optimized flow properties of Kisling's thermally conductive encapsulants further enhance their appeal. They provide high flexibility to meet various processing requirements, ensuring reliable operation of electronic components throughout their lifespan. This feature is particularly beneficial in the automotive industry, where reliability and durability are paramount.

Kisling's encapsulants also contribute to significant efficiency gains, achieving high thermal conductivity that helps reduce peak values in electronic components. This reduces the risk of overheating and ensures the components operate at their optimal temperatures.

For those seeking a deeper understanding of these encapsulants, a whitepaper is available. It offers comprehensive information on the current state of the art, future trends, and even includes a case study.

It's worth noting that polyurethane encapsulants, while not thermally conductive, do offer their own set of advantages. They ensure reliable and complete enclosure of complex geometries, offering an excellent cost-performance ratio.

In conclusion, Kisling's thermally conductive encapsulants are indispensable in a wide range of applications, from the automotive industry to electronics and beyond. Their ability to efficiently manage heat and ensure reliable operation makes them a vital tool in the modern electronics industry.

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