IoT Now CEO's Comprehensive Guide for IFPP 2024 Event
In an exclusive interview, Dr. Philipp Schulte, CEO of Giesecke+Devrient Mobile Security, shares his vision for the future of IoT device manufacturing. He discusses the transformative potential of the In-Factory Provisioning Platform (IFPP) and the company's AirOn360 In-Factory eSIM.
The IFPP is making waves in the industry by simplifying the process of provisioning SIMs in the factory, as described by Antony Savvas. This innovation significantly impacts the future of IoT device manufacturing, enabling seamless, secure, and scalable device onboarding directly at the point of manufacture or first boot.
Giesecke+Devrient’s AirOn360 In-Factory eSIM contributes to this transformation by providing a solution that embeds eSIM profiles during the manufacturing process. This in-factory eSIM provisioning allows IoT devices to be connected immediately and securely once deployed, streamlining operational processes and supporting the remote lifecycle management of devices across global networks.
The benefits of IFPP are numerous. It enables zero-touch, secure device onboarding at scale without manual SIM swaps or physical handling after production. It also enhances supply chain visibility and device lifecycle management, aligning with connected manufacturing systems and real-time data sharing across operations, which improve efficiency and reduce costs.
Moreover, IFPP supports advanced IoT use cases such as predictive maintenance, remote monitoring, and data-driven decision making by ensuring devices are reliably connected once deployed. Furthermore, it facilitates integration with private 5G networks, providing ultra-low latency and secure communication essential for future industrial AI and automation.
The focus of this issue is on groundbreaking changes in IoT device manufacturing. Experts are analyzing how these innovations will shape the future of IoT, with China aiming for 3.6 billion mobile IoT connections. Other notable developments include Oracle integrating AT&T IoT connectivity into its enterprise communications platform, Memfault joining STMicroelectronics partner program, and Qualcomm acquiring Sequans 4G technology.
As we delve deeper into the details of the company's AirOn360 In-Factory eSIM, it becomes clear that these innovations are expected to have a significant impact on the future of IoT. Matt Hatton details the functionality of IFPP and its benefits for connected device makers, while George Malim discusses SIMbiotic relationships in his Editor's Comment. A case study on Giesecke+Devrient's AirOn360 In-Factory eSIM offerings also contributes to the discussion, highlighting its role in the revolution of device connectivity.
In conclusion, the combination of IFPP and AirOn360 empowers manufacturers to create a more efficient, secure, and scalable industrial IoT ecosystem. These innovations are poised to drive faster deployment, improved security, operational efficiency, and the scalability of connected devices in manufacturing and beyond, shaping the future of IoT.
Data-and-cloud-computing technology is playing a crucial role in the development of the In-Factory Provisioning Platform (IFPP) and Giesecke+Devrient's AirOn360 In-Factory eSIM, facilitating seamless, secure, and scalable device onboarding directly at the point of manufacture or first boot. These technologies enable manufacturers to create a more efficient, secure, and scalable industrial IoT ecosystem, shaping the future of IoT.
