Micron Unveils Next-Gen HBM4, Sets New Industry Standards
Micron Technology has announced significant advancements in its High Bandwidth Memory (HBM) portfolio. The company is set to offer HBM4E with customizable logic die options, while its HBM4 modules have already surpassed industry standards in terms of bandwidth and speed.
Micron's latest HBM4 modules deliver an impressive bandwidth of over 2.8TB/s, with pin speeds exceeding 11Gbps. This exceeds the official JEDEC HBM4 specification of 2TB/s and 8Gbps, demonstrating the company's commitment to pushing technological boundaries.
The company's approach to HBM4 has proven successful, with revenues now at an annualized run rate of $8 billion. Micron has started shipping samples of its next-generation HBM4 memory, indicating its readiness to meet growing market demands. These samples, set to be delivered to customers in the second half of 2024, are expected to provide industry-leading performance and best-in-class power efficiency.
Micron's plans to offer customizable HBM4E and its recent achievements in the HBM market position the company to take a larger share of the estimated $100 billion stock market today. With its focus on high performance and efficiency, Micron continues to strengthen its role as a key player in the memory industry.
