Nova Ltd Unveils Cutting-Edge Optical Metrology Solution for Semiconductor Packaging
Nova Ltd has unveiled the Nova WMC, a cutting-edge optical metrology solution tailored for semiconductor packaging. President and CEO Gaby Waisman expressed enthusiasm about introducing this innovative product to customers.
The Nova WMC tackles industry challenges such as high warpage, asymmetrical shapes, and diverse surface conditions. It delivers high throughput and nanometer precision, making it an efficient tool for today's semiconductor packaging needs.
Designed as a modular platform, the Nova WMC accommodates various wafer sizes and forms. It supports multiple metrology technologies, ensuring versatility in its applications. This adaptability has already attracted a leading memory manufacturer, who has adopted the platform for High Bandwidth Memory production. Furthermore, additional orders have poured in from logic, memory, and power device manufacturers, testament to the Nova WMC's wide appeal and capability.
The Nova WMC is particularly well-suited for the evolving demands of 2.5D and 3D advanced packaging processes, including hybrid bonding. Its flexibility and high-precision measurements make it an ideal tool for these complex, next-generation packaging techniques.
The Nova WMC, with its high throughput, nanometer fidelity, and adaptability, has been well-received by the industry. A leading memory manufacturer has already adopted it for High Bandwidth Memory production, with additional orders from various device manufacturers. As semiconductor packaging evolves, particularly in 2.5D and 3D processes, the Nova WMC is poised to play a significant role.
